发明名称 Internal connection system for power semiconductors comprising large-area terminals
摘要 According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.
申请公布号 US2006252253(A1) 申请公布日期 2006.11.09
申请号 US20040547119 申请日期 2004.01.23
申请人 发明人 SELIGER NORBERT;WEIDNER KARL;ZAPF JOERG
分类号 H01L21/4763;H01L21/60;H01L23/373 主分类号 H01L21/4763
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