SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

摘要

A first wiring section positioned on one side of a substrate is connected with a second wiring section positioned on the other side by wiring. A side plane electrode to be connected with the first wiring section is formed, and the second wiring section is formed on an insulating layer formed on the substrate. An exposing edge of the second wiring section formed after complete cutting into separate semiconductor packages is wired with the side plane electrode, by using nano metal particles by an inkjet method. Especially when copper is used, reduction of a metal surface oxide film and/or organic material removal by atomic hydrogen is performed to the wiring provided by the ink jet method.