发明名称 POLISHING HEAD AND POLISHING DEVICE PROVIDED WITH THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing head with a simple structure which immediately copes with the change of a set vale of a pressure distribution. <P>SOLUTION: A plurality of through-holes 32a-32c are provided in the face of a backing film 32 with a prescribed pattern. Fluid passages respectively made to correspond to each of the through-holes 32a-32c are provided to a body of the polishing head. The polishing head is provided with rotating rings 316-318 and motors M1-M3 for rotating each rotating ring 316-318 as a passage opening/closing mechanism for opening/closing each fluid passage. Each rotating ring 316-318 has through-holes 316a-318c respectively made to correspond to each of the through-holes 32a-32c of the backing film 32. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006305640(A) 申请公布日期 2006.11.09
申请号 JP20050127537 申请日期 2005.04.26
申请人 SEIKO EPSON CORP 发明人 HIROZAWA MINORU
分类号 B24B37/005;B24B37/04;B24B37/30;H01L21/304 主分类号 B24B37/005
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