| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non contact IC card in which a card body has smoothness/printing aptitude and can be formed for the thickness of the card body to meet the standard. <P>SOLUTION: The non contact IC card in accordance with the present invention has holes 6 formed at the points of an inner layer 2e corresponding to the position where a rewrite part is plastered. When forming the IC card, PET-G resin between the inner layers 2d and 2f flows in molten state in the direction of the holes 6. Therefore, the parts of the inner layers 2d and 2f corresponding to the holes 6, that is, the part where the rewrite part 5 is to be plastered is formed to fall by the cubic volume of the holes 6. Herewith, the rewrite part 5 is laminated on the part which falls when carrying out thermal compression, thereby enabling to provide the non contact IC card having smoothness/thickness over the whole IC card and the rewrite part 5 of good printing aptitude. <P>COPYRIGHT: (C)2007,JPO&INPIT |
