发明名称 |
METHOD FOR CUTTING-OFF WIRE MATERIAL, AND METHOD FOR RE-FORMING END FACE OF WIRE MATERIAL |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To form a flat end face of the cut-off end face produced by cutting-off a wire material, such as photonic crystal fiber (PCF), and further to achieve an excellent optical property by preventing polishing abrasive grains from intruding into pores exposed on the end face. <P>SOLUTION: The wire material is cut off along a locus of a machining spot caused by a converged light point by forming the converged light point of a femto second laser beam on the surface portion or the inside of the wire material, such as PCF, along a required scanning path. Further, the end face of the wire material is smoothed by irradiating the end face with the femto second laser beam. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
申请公布号 |
JP2006305580(A) |
申请公布日期 |
2006.11.09 |
申请号 |
JP20050128183 |
申请日期 |
2005.04.26 |
申请人 |
HIKARI PHYSICS KENKYUSHO:KK;CYBER LASER KK;UNIV KINKI |
发明人 |
OKUNO MASAFUMI;TSUGITA HIROSHI;WATABE AKIRA;SUMIYOSHI SATOMI;YOSHIDA MINORU |
分类号 |
B23K26/38;B23K26/12;B23K26/14;B23K26/40;G02B6/00;G02B6/032 |
主分类号 |
B23K26/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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