TWO-LAYER FILM, METHOD FOR PRODUCING TWO-LAYER FILM AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a two-layer film of a polymer layer and a metal layer in which the metal layer has sufficient adhesion strength even if being used in high density printed wiring, its production method and a method for manufacturing a printed wiring board using its method. SOLUTION: The two-layer film includes a polymer film 10; a first metal film 12 formed on the polymer film and having nickel containing a nitrogen atom of 60-100 wt.%; and a second metal film 14 formed on the first metal film and having copper mainly as a main component. The method for producing the two-layer film includes a process for forming the first metal film containing nickel of 60-100 wt.% by a vacuum evaporation method, an ion plating method or a sputtering method under an atmosphere containing nitrogen gas on the polymer film; and a process for forming the second metal film having copper as the main component on the first metal film. COPYRIGHT: (C)2007,JPO&INPIT