| 摘要 |
PROBLEM TO BE SOLVED: To provide a tool which can avoid adhesion of the terminal electrodes of respective chips in the process for forming the terminal electrodes. SOLUTION: Second thin plate members 21 and 22 have a plurality of slits 211 and 221 penetrating in the thickness direction. A third thin plate member 30 has a plurality of through holes 301. The second thin plate members 21 and 22 and the third thin plate member 30 are combined such that the slits 211 and 221 and the through holes 301 are interconnected in the thickness direction. A first thin plate member 10 is combined to close interconnection passages 301, 211 and 221 at least partially. COPYRIGHT: (C)2007,JPO&INPIT
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