| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus capable of eliminating a cause of particle generation and the necessity of a substrate cooling mechanism by eliminating the necessity of heating a substrate in coating an adhesion reinforcing agent on the main surface of a substrate in substrate processing of forming an application film after coating the adhesion reinforcing agent on the main surface of the substrate. SOLUTION: The apparatus has a pair of electrodes 22a, 22b for plasmaizing a nitrogen gas containing steam of HMDS, and includes a turning-to-plasma/adhesion reinforcement processing section having a nozzle 18 for jetting the adhesion reinforcing gas turned to plasma during passing through a pulse electric field generated between the pair of electrodes toward the main surface of a substrate W transferred by transfer rollers 16. COPYRIGHT: (C)2007,JPO&INPIT
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