| 摘要 |
PROBLEM TO BE SOLVED: To accurately and quickly form a fine conductive circuit of high density on the inner wall of a hollow body. SOLUTION: A copper film 2 having thickness of 0.3μm is formed on an inner wall 11a of a cylindrical hollow body 1 which is injection molded with cycloolefin polymer of a transparent synthetic resin by a high frequency ion plating method. Then, laser beam is irradiated from the rear side of the copper film 2 so that it passes through the wall thickness from the outside of the hollow body 1, so other non-circuits 2b are removed except for a conductive circuit 2a which comes to be a spiral antenna. Since the conductive circuit 2a is covered with the hollow body 1 itself, no protective cover is required to prevent flaw, corrosion, or sticking of conductive substance, resulting in a lower cost and a smaller size. COPYRIGHT: (C)2007,JPO&INPIT
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