发明名称 |
Al-Ni-B ALLOY WIRING MATERIAL AND ELEMENT STRUCTURE USING THE SAME |
摘要 |
<p>This invention provides an Al-based alloy wiring material that, in a display device comprising a thin-film transistor and a transparent electrode layer, can be connected directly to a transparent electrode layer such as ITO or IZO and further can be connected directly to a semiconductor layer such as n<SUP>+</SUP>-Si. The Al-based alloy wiring material is an Al-Ni-B alloy wiring material comprising Ni and B and satisfies a requirement represented by formulae 0.5 = X = 10.0, 0.05 = Y = 11.0, Y + 0.25X = 1.0, and Y + 1.15X = 11.5 wherein X represents the content of nickel in atomic percentage (at%); and Y represent the content of boron in atomic percentage (at%). The balance consists of aluminum.</p> |
申请公布号 |
WO2006117954(A1) |
申请公布日期 |
2006.11.09 |
申请号 |
WO2006JP306676 |
申请日期 |
2006.03.30 |
申请人 |
MITSUI MINING & SMELTING CO., LTD.;URABE, HIRONARI;MATSUURA, YOSHINORI;KUBOTA, TAKASHI |
发明人 |
URABE, HIRONARI;MATSUURA, YOSHINORI;KUBOTA, TAKASHI |
分类号 |
C22C21/00;H01B1/02;H01L21/285;H01L21/3205;H01L23/52;H01L29/786 |
主分类号 |
C22C21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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