发明名称 Al-Ni-B ALLOY WIRING MATERIAL AND ELEMENT STRUCTURE USING THE SAME
摘要 <p>This invention provides an Al-based alloy wiring material that, in a display device comprising a thin-film transistor and a transparent electrode layer, can be connected directly to a transparent electrode layer such as ITO or IZO and further can be connected directly to a semiconductor layer such as n<SUP>+</SUP>-Si. The Al-based alloy wiring material is an Al-Ni-B alloy wiring material comprising Ni and B and satisfies a requirement represented by formulae 0.5 = X = 10.0, 0.05 = Y = 11.0, Y + 0.25X = 1.0, and Y + 1.15X = 11.5 wherein X represents the content of nickel in atomic percentage (at%); and Y represent the content of boron in atomic percentage (at%). The balance consists of aluminum.</p>
申请公布号 WO2006117954(A1) 申请公布日期 2006.11.09
申请号 WO2006JP306676 申请日期 2006.03.30
申请人 MITSUI MINING & SMELTING CO., LTD.;URABE, HIRONARI;MATSUURA, YOSHINORI;KUBOTA, TAKASHI 发明人 URABE, HIRONARI;MATSUURA, YOSHINORI;KUBOTA, TAKASHI
分类号 C22C21/00;H01B1/02;H01L21/285;H01L21/3205;H01L23/52;H01L29/786 主分类号 C22C21/00
代理机构 代理人
主权项
地址