发明名称 POLISHING SUCTION PAD AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing suction pad regulating intrusion of polishing slurry from the surroundings, and also excellently holding a sucked state of a polishing target, and also to provide its manufacturing method. <P>SOLUTION: The polishing suction pad 12 is used for polishing the polishing target such as liquid crystal glass with the polishing slurry while sucking the polishing target. One face of a plate-like body 19, which is composed of a foamed body made of a thermosetting polymer having an open-cell structure, is made as a suction face 20 of the polishing target. A hot-melt adhesive layer 21 having a higher softening temperature than that of during the polishing is provided to the other face. The peripheral edge of the plate-like body 19 is compressed so as to form a compressed part 23 by pressurizing and heating at the temperatures higher than the softening temperature of the hot-melt adhesive layer 21. The intrusion of the polishing slurry to the compressed part 23 is regulated by melting and seeping the hot-melt adhesive layer 21 into the compressed part 23. The other face of the plate-like body 19 is bonded to a supporting film 22 by the heating and pressurizing. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006305650(A) 申请公布日期 2006.11.09
申请号 JP20050128538 申请日期 2005.04.26
申请人 INOAC CORP 发明人 YANO TADASHI;KATAYAMA YORIYUKI
分类号 B24B37/30;B24B41/06 主分类号 B24B37/30
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