| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip-type semiconductor laser device capable of reducing material and manufacturing cost and performing surface mounting. SOLUTION: A chip-type semiconductor laser device is configured in such a way that there is provided a disk-like resin stem 2 on a resin base 1 having an approximately rectangular plane, a semiconductor laser element 3 and PIN photodiode element 4 are mounted on the resin stem 2, one end of a first lead terminal 8a connecting with the semiconductor laser element 3 and one end of a second lead terminal 8b connecting with the PIN photodiode element 4 protrude on the upper surface of the resin stem 2. At the same time, the other ends of the first and second lead terminals 8a and 8b protrude from the side surface of the resin base 1. COPYRIGHT: (C)2007,JPO&INPIT
|
