发明名称 |
Package substrate, integrated circuit apparatus, substrate unit, surface acoustic wave apparatus, and circuit device |
摘要 |
On a piezoelectric substrate 23 , there are provided surface acoustic wave devices F<SUB>1 </SUB>and F<SUB>2 </SUB>in which predetermined circuit patterns are formed, and a package substrate 11 comprising side vias 16 formed in a caved manner in the thickness direction on side surfaces on which the surface acoustic wave devices are mounted. When the side vias 16 are each assumed to have the opening width phi and the maximum depth D, a size satisfying phi/2<D is assumed. Thereby, it is possible to prevent protrusion of a soldering fillet applied on the side via.
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申请公布号 |
US2006249825(A1) |
申请公布日期 |
2006.11.09 |
申请号 |
US20060480500 |
申请日期 |
2006.07.05 |
申请人 |
TDK CORPORATION |
发明人 |
NAKANO MASAHIRO |
分类号 |
H01L23/02;H05K1/02;H05K3/34 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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