发明名称 CIRCUIT DEVICE AND ITS MANUFACTURING PROCESS
摘要 <P>PROBLEM TO BE SOLVED: To provide a circuit device in which connection reliability is enhanced from the electrode of a circuit element to an external electrode, and to provide its manufacturing process. <P>SOLUTION: The circuit device 10A comprises a circuit element 11 having an electrode 14 formed on the periphery, a joint 15 for connection with the surface of the electrode 14, and rewiring 16 extending in parallel with the major surface of the circuit element continuously to the joint 15. The joint 15 and the rewiring 16 are formed of an integrated metal. Since there is no joint of different kinds of material between them, connection reliability of the entire device is enhanced for thermal stress, or the like. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006310530(A) 申请公布日期 2006.11.09
申请号 JP20050131130 申请日期 2005.04.28
申请人 SANYO ELECTRIC CO LTD 发明人 USUI RYOSUKE;INOUE YASUNORI;MIZUHARA HIDEKI
分类号 H01L23/12 主分类号 H01L23/12
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