| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED lamp free from a shift between an optical axis of an LED chip and an optical axis of a lens formed of a sealing resin of the LED chip, and preventing a blow hole from occurring on a soldered part when soldering. <P>SOLUTION: A cylindrical ring 3 is integrated with a translucent resin 2 for sealing the LED chip mounted at an end of a lead frame 4a. A protrusion 13 is provided in the vicinity where the LED chip is mounted on an external side face of a pair of lead frames 4a and 4b, and a slit 10 having one end opened and extending in the longitudinal direction (the direction orthogonal to the circumferential direction) of the ring 3 is provided at an opposite position on the sidewall of the ring 3. The protrusion 13 of the lead frames 4a and 4b is resin-sealed in contact with a bottom face 20 of the slit 10 of the ring 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
