发明名称 WIRING CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a wiring circuit substrate wherein the positional restriction of its wiring layer which is generated when designing it, and the aligning accuracy of its wiring layer which is required when manufacturing it, are relaxed. SOLUTION: In the wiring circuit substrate, a ground pattern 3 comprises a plurality of ground lines 101, 102 and 103 formed integrally with one another. The plurality of ground lines 101 are arranged in parallel with one another at equal spaces. The plurality of ground lines 102 are arranged between the ground lines 101 adjacent to each other in parallel with one another at equal spaces. Also, the plurality of ground lines 103 are so arranged between the ground lines 101 adjacent to each other in parallel with one another at equal spaces that each ground line 103 forms a predetermined angle with respect to each ground line 102. Each ground line 103 is so formed that one end of a first ground line 102 and the other end of a second ground line 102 adjacent to the first ground line 102 are connected by the ground lines 103. The respective ground lines 101, 102 and 103 form equilateral-triangle-like openings 3a, 3b. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006310545(A) 申请公布日期 2006.11.09
申请号 JP20050131308 申请日期 2005.04.28
申请人 NITTO DENKO CORP 发明人 MOTOGAMI MITSURU;SAITO TOMONORI;MORITA YOSHIFUMI;YAMAMOTO YOSHIFUMI
分类号 H05K1/02 主分类号 H05K1/02
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