发明名称 REFLOW TREATMENT METHOD FOR METAL PLATING MATERIAL, METAL PLATING MATERIAL, AND REFLOW TREATMENT DEVICE FOR METAL PLATING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a reflow treatment method for a metal plating material in which surface ruggedness, wrinkles and spark damage are hardly generated, to provide a metal plating material after a reflow in which the degree of thickness deviation is reduced, and to provide a reflow treatment device where the reflow treatment method can be smoothly and surely performed. SOLUTION: The reflow treatment method is characterized in that a metal plating material in which a plating layer is formed on the surface is heated by induction heating, so as to melt the plating layer, and the hot dip plating layer is resolidified. The metal plating material is the one subjected to reflow treatment by the above method, and the degree of thickness deviation in the plating layer of the surface is≤1.5. The reflow treatment device is provided with: a carrying means of continuously running a long-length metal plating material in which a plating layer is formed on the surface; and an induction heating means of heating the metal material in the middle of the carrying means, so as to melt the plating layer. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006307335(A) 申请公布日期 2006.11.09
申请号 JP20060089546 申请日期 2006.03.28
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KIMURA HARUNOBU;NAGAHISA KENICHI;ITAGAKI YUKI;TAKAHASHI ISAO;HIROTA HIROSHI;HASEGAWA KATSUMASA;IWAMA HISASHI;MATSUSHIMA TAKESHI
分类号 C25D5/50;H05B6/10 主分类号 C25D5/50
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