发明名称 HEAT-SEALABLE LAMINATED POLYPROPYLENE RESIN FILM AND PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a heat-sealable laminated polypropylene resin film having heat-sealing strength and sealability enough to package a heavy load and a package obtained by using the film. SOLUTION: The oriented polypropylene resin film is obtained from a laminate having at least three layers of a substrate layer which is obtained from a crystalline polypropylene resin and a propylene-α-olefin copolymer and has a melting point of 155°C or below, an intermediate layer, and a heat fusion layer of a melting point of 150°C or below. In the heat-sealable laminated polypropylene resin film, at least 5 wt.% of a resin used in the heat fusion layer is incorporated. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006305884(A) 申请公布日期 2006.11.09
申请号 JP20050131759 申请日期 2005.04.28
申请人 TOYOBO CO LTD 发明人 KAWAI KENJI;OKI SUKEKAZU
分类号 B32B27/32;B65D65/40 主分类号 B32B27/32
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