| 摘要 |
The invention relates to a process for joining a hollow profiled section ( 1 ) to a component ( 2 ) of a vehicle which bears flat against it by means of soldering, with a solder ( 4 ) being introduced between the hollow profiled section ( 1 ) and the component ( 2 ) and then being liquefied by the introduction of energy and, as it solidifies, producing a fixed join between the hollow profiled section ( 1 ) and the component ( 2 ). To achieve a durable soldered join between the hollow profiled section ( 1 ) and a component ( 2 ) of any desired configuration which bears flat against it in a simple way, it is proposed that a hollow ( 3 ) is formed on the component ( 2 ), in that the solder ( 4 ) is deposited in the hollow ( 3 ), in that the component ( 2 ) is then positioned relative to the hollow profiled section ( 1 ) with the hollow opening ( 6 ) facing the hollow profiled section ( 1 ), and in that then, in the contact position, the component ( 2 ) is acted on by resistive electricity in the hollow region, with a compressive force being exerted on the hollow outer side ( 8 ) by means of a resistance-welding electrode.
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