发明名称 HEATED PRESSURE TRANSDUCER
摘要 <p>A pressure transducer assembly including a sensor enclosure, a pressure sensor received in the sensor enclosure, a tube connected to the pressure sensor and extending out of the sensor enclosure for connection to a source of fluid, an electronics circuit board electrically connected to the pressure sensor, and an electronics enclosure containing the electronics board and secured to the sensor enclosure. The electronics enclosure includes an external housing constructed of thermally conductive material, and a heat transfer plate constructed of thermally conductive material. The heat transfer plate is in physical contact with heat-generating elements of the electronics circuit board and in physical contact with the external housing, such that heat from the heat-generating elements can be dissipated through the external housing. This arrangement allows the circuit board to remain cool even as the sensor is heated.</p>
申请公布号 WO2006118894(A1) 申请公布日期 2006.11.09
申请号 WO2006US15768 申请日期 2006.04.25
申请人 MKS INSTRUMENTS, INC.;POULIN, JAMES, M.;MELLO, KEITH, F. 发明人 POULIN, JAMES, M.;MELLO, KEITH, F.
分类号 G01L19/14;G01L19/04 主分类号 G01L19/14
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