Heat dissipating module for e.g. central processing unit, has vacuum chamber provided with capillary structure in which working fluid is provided, where circumference of heat dissipating body is provided with heat dissipating fins

摘要

The module has a heat conducting unit (1) with a hollow cylinder, where an inside of a wall of the cylinder is provided with a vacuum chamber and the cylinder has inner and outer housings. The chamber is provided with a capillary structure (112, 122) in which a working fluid is provided. A heat dissipating body comprising a through hole is connected with an outer circumference of the unit, where circumference of the body is provided with several heat dissipating fins.