发明名称 |
TRENNUNG VON INTEGRIERTEN OPTISCHEN MODULEN UND STRUKTUREN |
摘要 |
A thick wafer is diced by partially dicing a first side to form a first dice, flipping the wafer so that the first side is now in contact with a dicing tape, and dicing a second side. The dicing of the second side may be achieved by aligning a dicing tool to the first dice and/or alignment marks on the wafer. The thick wafer may be a composite wafer including two or more wafers bonded together. These two wafers may be different thicknesses and/or different materials. |
申请公布号 |
DE60215019(D1) |
申请公布日期 |
2006.11.09 |
申请号 |
DE2002615019 |
申请日期 |
2002.03.05 |
申请人 |
DIGITAL OPTICS CORP. |
发明人 |
KATHMAN, D.;HAN, HONGTAO;MATHEWS, JAY;HAMMOND, BARNETT |
分类号 |
H01L27/14;H01S5/02;G02B6/42;H01L21/301 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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