FLIP CHIP MOUNTING SHIFT INSPECTING METHOD AND MOUNTING APPARATUS

摘要

In a flip chip mounting shift inspecting method, an alignment mark of a chip and a first corner section of the chip viewed from a direction of recognizing the alignment mark of the chip are recognized by image processing by a first CCD camera prior to mounting. After mounting, an alignment mark of a substrate and a second corner section at a position same as that of the corner section of the chip are recognized by image processing by a second CCD camera from a direction opposite to a circuit plane of the chip. The relative positional relationship between the alignment marks of the substrate and the chip is calculated, with the first and the second corner sections as references, and a mounting shift quantity from a prescribed mounting positional relationship is calculated. Thus, mounting shift conformity is judged. A mounting apparatus for performing such method is also provided. In the conventional technologies, inspections are performed off-line by means of an X-ray imaging apparatus and an infrared microscope, and a tact time is difficult to be shortened and total inspection is not easily performed. This invention made possible to perform desired mounting shift inspection with a simple structure and to remarkably shorten the process.