| 摘要 |
An LED module is provided to improve heat radiation efficiency by simplifying the structure of an LED module having excellent heat resistance. An LED chip(11) is mounted on a substrate part(10). A printed circuit is connected to the LED chip by wire or a flip-chip bonding method. A metal radiation pin(14) is coupled to a vertically perforated insertion hole(13) of the substrate part. A reflection part(20) is stacked on the substrate part. The LED chip and the upper part of the radiation pin are opened by a vertically perforated reflection hole(21). A reflection surface(22) is formed along the inner circumferential surface of the reflection surface. The radiation pin is coupled to the insertion hole of the substrate part by a rivet. An electrode(15) connected to the radiation pin is printed on the upper or lower surface of the substrate part.
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