| 摘要 |
A light emitting device is provided to radiate heat through a sub mount substrate by embodying a light emitting device in which a plurality of light emitting cells are arrayed as a flip-chip structure. A plurality of light emitting cells are formed on a base substrate(110) in a light emitting cell block, including an N-type semiconductor layer(120), a P-type semiconductor layer(140) formed in a part of the N-type semiconductor layer, and an insulation layer reflecting layer(170). A sub mount substrate is flip-chip bonded to the light emitting cell block. An N-type semiconductor layer of one light emitting cell in the light emitting cell block is connected to a P-type semiconductor layer of another light emitting cell adjacent to the one light emitting cell. The insulation film reflecting layer is composed of more than two different insulation layers that are alternately stacked. Each insulation layer in the insulation film reflecting layer has a thickness of a wavelength/(4 refractivity).
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