发明名称 COMPOSITE FOR BULK MOLD COMPOUND
摘要 Provided is a bulk mold compound composition, which has excellent dispersibility, surface roughness, dimensional stability, thermal stability and flame resistance, and is useful for producing electric materials and building materials. The bulk mold compound composition comprises: 100 parts by weight of a mixed polymer resin containing an unsaturated polyester resin and polystyrene resin; 170-400 parts by weight of aluminum hydroxide having a particle diameter of 1-15.0 micrometers; 20-200 parts by weight of hard calcium carbonate having a particle diameter of 0.1-8.0 micrometers; 5.0-30 parts by weight of glass fiber having a length of 3-12 mm; 10-30 parts by weight of chlorinated paraffin; 10-30 parts by weight of antimony trioxide; and 0.5-5 parts by weight of a surfactant.
申请公布号 KR20060115545(A) 申请公布日期 2006.11.09
申请号 KR20050038168 申请日期 2005.05.06
申请人 CHUNGJU NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION 发明人 KIM, SUNG RYONG;KWON, GI JUN;KIM, DAE HUN;KIM, HONG KYOUNG;KIM, KYOUNG MIN
分类号 C08L67/06;C08K3/20 主分类号 C08L67/06
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