| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of soldering which causes entirely no deformation or can greatly reduce the deformation accompanied by soldering at the joined portion and also can improve ESD performance by soldering without contacting the joined portion. SOLUTION: A soldering apparatus comprises a joining head section 72 provided with a main passage 82 and two auxiliary passages communicating with the main passage 82, a laser device connected with the main passage 82, through which a laser beam 90 can be irradiated, a pressure gas supply device connected with an auxiliary passage 84, through which pressure gas can be supplied to the main passage 82, a solder ball supply device connected with the other auxiliary passage 86, through which a solder ball 94 can be supplied to the main passage 82. The main passage 82 is provided with a portion in the tapered structure which holds the solder ball 94. COPYRIGHT: (C)2007,JPO&INPIT |
