| 摘要 |
PROBLEM TO BE SOLVED: To materialize an enhancement of a heat-dissipating performance, simultaneously, a reduction in a production cost and an enhancement of a durability. SOLUTION: An insulating circuit board 11 comprises a wiring layer 21 mounting a power device 91 on the surface, an insulating board 31 joined to the back face of the wiring layer 21, and a corrugated fin 41 which has a plurality of fins 41a formed in a corrugated condition and joins a top 41b of each fin 41a to the back face side of the insulating board 31. COPYRIGHT: (C)2007,JPO&INPIT |
