| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board and its manufacturing method which can reduce the number of layers on the wiring circuit board, improve the electrical characteristics, lower any variations in the resistance value of a printed resistor 14, and reduce the size of the printed resistor 14 for the wiring circuit board with a built-in capacitor wherein the layer of a dielectric 1 is composed of a sheet material 3 sandwiched by at least one metallization layer 2 on both sides of the board. SOLUTION: A capacitor electrode 13 is only formed on a metallization layer on one side of a sheet material 3, while a capacitor electrode 9 and a wiring section 12 are formed on a metallization layer on the other side, and a dielectric 1 is present only between both of those capacitor electrodes. On the metallization layer on the other side, a surface side opposed to that in contact with the dielectric 1 as well as the capacitor electrode 9 and the wiring section 12 side surfaces are covered with an insulating material 6 except for a via hole area 8. COPYRIGHT: (C)2007,JPO&INPIT
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