| 摘要 |
PROBLEM TO BE SOLVED: To provide a barrel type plating apparatus for inhibiting an article to be plated from adhering to the surface of a cathode. SOLUTION: The barrel type plating apparatus 1 has a cathode drive mechanism 30 accommodated in an accommodation space S1; thereby rotates the cathode 8 around its axis in a barrel 6 independently from the rotation of the barrel 6; increases a relative speed of the surface of the cathode 8 with respect to a group 4 of electronic parts that are agitated in the barrel 6 by the rotation of the cathode 8; accordingly inhibits a plated film from forming between the cathode 8 and the electronic parts 33; and inhibits the electronic parts 33 from adhering to the surface of the cathode 8. As a result, the barrel type plating apparatus 1 almost does not change a plating condition in the barrel 6, and reduces variations in plating thickness among the respective electronic parts in the group 4 of the electronic parts. COPYRIGHT: (C)2007,JPO&INPIT
|
