| 发明名称 |
Device with area array pads for test probing |
| 摘要 |
A durable chip pad for integrated circuit (IC) chips, semiconductor wafer with IC chips with durable chip pads in a number of die locations and a method of making the IC chips on the wafer. The chip may be probed for performance testing with the probe contacting the durable chip pads directly.
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| 申请公布号 |
US2006249854(A1) |
申请公布日期 |
2006.11.09 |
| 申请号 |
US20060478933 |
申请日期 |
2006.06.29 |
| 申请人 |
CHENG TIEN-JEN;EICHSTADT DAVID E;GRIFFITH JONATHAN H;KNICKERBOCKER SARAH H;MCKNIGHT SAMUEL R;PETRARCA KEVIN S;SRIVASTAVA KAMALESH K;QUON ROGER A |
发明人 |
CHENG TIEN-JEN;EICHSTADT DAVID E.;GRIFFITH JONATHAN H.;KNICKERBOCKER SARAH H.;MCKNIGHT SAMUEL R.;PETRARCA KEVIN S.;SRIVASTAVA KAMALESH K.;QUON ROGER A. |
| 分类号 |
H01L23/48;H01L23/485;H01L23/58;H01L29/40 |
主分类号 |
H01L23/48 |
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