| 摘要 |
A probe card (1) comprises a plurality of probe pins (50) each having a wafer-side plunger (51) on one end side and a board-side plunger (52) on the other end side, two upper and lower probe guides (30, 40) in which the plurality of probe pins (50) are arranged correspondingly to the arrangement of external terminals for a semiconductor wafer and which supports the plurality of probe pins (50) with the wafer-side plungers (51) of the probe pins (50) facing thereto, a printed board (10) having a pad (13) with which the board-side plungers (52) for the probe pins (50) supported by the probe guides (30, 40) come in contact, and a reinforcing member (20) disposed on the back of the printed board (10). And the probe guides (30, 40) are made of a material having substantially the same thermal expansion coefficient as that of the semiconductor wafer, and are fixed at their peripheries and centers to the printed board (10) and reinforcing member (20). The probe card (1) having such arrangement is capable of maintaining the needle position accuracy of the probe pin (50) with respect to the external terminals for the semiconductor wafer and the pad (13) of the printed board (10) at a high level.
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