| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sealed RF module which constitutes a transmission line with a lead frame without deteriorating the high frequency characteristics. <P>SOLUTION: The module has a semiconductor amplifier element chip 3 containing a power amplifier circuit, upper layer leads 4a forming a signal transmission line, lower layer leads 4b forming a reference potential conductor pattern, a plurality of conductive wires 6 for electrically connecting the upper layer leads 4a with the lower layer leads 4b, and a seal 7 for sealing them. For each of the upper and lower layer leads 4a, 4b, two different lead frames are laminated one above the other. <P>COPYRIGHT: (C)2007,JPO&INPIT |
