发明名称 |
SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING AND MEASURING SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of being easily subjected to a physical test without deteriorating characteristics. <P>SOLUTION: According to a method of measuring a semiconductor device in which an element layer provided with a test element including a terminal is sealed with first and second films having flexibility, the first film formed over the terminal is removed to form a contact hole to the terminal, the contact hole is filled with a resin containing a conductive material, heating is carried out after arranging a wiring substrate having flexibility over the resin with which filling has been performed so that the terminal and the flexible wiring substrate are electrically connected via the resin containing a conductive material, and a measurement is performed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2006310810(A) |
申请公布日期 |
2006.11.09 |
申请号 |
JP20060084606 |
申请日期 |
2006.03.27 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
TSURUME TAKUYA;ASANO ETSUKO |
分类号 |
H01L29/786;G01R31/26;G01R31/28;H01L21/56;H01L21/60 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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