| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To test a semiconductor device with reduced labors and costs in the semiconductor device where a plurality of semiconductor storage devices are mounted in one package. <P>SOLUTION: In the semiconductor device 20, a flash memory 30 and an SRAM 40 where an address bus 27, a data bus 28, and a part of control signal lines 25 and 26 are shared are mounted in the one package or constituted on the same chip. In the semiconductor device 20, using a write state machine 33 of the flash memory 30 as a test control circuit, an address signal, a data signal and a control signal of the SRAM 40 are controlled, and data is written/read from the flash memory 30 to the SRAM 40 to test the SRAM 40. By only testing the flash memory 30 from an external tester, the SRAM 40 is also tested. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
