| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology to improve the workability in mounting while at the same time achieving the reduction in size and thickness required for an optical semiconductor device. <P>SOLUTION: The optical semiconductor device comprises an optical semiconductor element 1; a first pad 2 which consists of a placement 3a to place the optical semiconductor element 1, and a first electrode 3b electrically connected to the outside, with the area of a planar portion of the first electrode 3b being smaller than that of the placement 3a; a second pad 4 consisting of a second connection 4a electrically connected to the optical semiconductor element 1 and a second electrode 4b electrically connected to the outside, with the area of a planar portion of the second electrode 4b being smaller than that of the second connection 4b; and a seal 5 for sealing at least one of the optical semiconductor element 1, the first pad 3, and the second pad 4. The first pad 2 and the second pad 4 are exposed in such a manner that the planar portions of the first and second electrodes 3b and 4b may be nearly flush with the surface of the seal 5. <P>COPYRIGHT: (C)2007,JPO&INPIT |
