发明名称 METHOD OF MANUFACTURING RESIN-FILLED SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin-filled substrate which can prevent unfilling of an opening and roll-in of a void and has small polishing load (excellent in productivity). <P>SOLUTION: The method of manufacturing a resin-filled substrate is used which includes a process of rotating non-contact roll (R) at a circumferential velocity (v) (mm/sec.) so that the rotation direction of a portion of a substrate from a rotation axis is opposite to a moving direction while linearly moving the non-contact roll (R) at a moving velocity (i) (mm/sec.) in a direction horizontal to a substrate face and a direction vertical to the rotation axis of the (R), and filling a resin paste (J) having a loss elasticity (G") of 50-100,000 Pa into the opening provided on the substrate. In this method, the moving velocity (i) and the circumferential velocity (v) are in a relation of v≥10×i. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006310788(A) 申请公布日期 2006.11.09
申请号 JP20060064293 申请日期 2006.03.09
申请人 SAN NOPCO LTD 发明人 KOUDA KAZUHIKO
分类号 H05K3/40;H05K1/11;H05K3/46 主分类号 H05K3/40
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