发明名称 COMPOSITE, PREPREG, METAL FOIL-CLAD LAMINATED BOARD AND MANUFACTURING METHOD OF PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a composite excellent in adhesion reliability and sufficiently restrained from the generation of resin powders or fluffs of fibers and the like that may fall off, a prepreg using such a composite, a metal foil-clad laminated board, a multilayer printed-wiring board, and its manufacturing method. SOLUTION: The composite is obtained by impregnating a fibrous sheet with a curable resin composition. The cured product of the curable resin composition has a storage modulus of 100-2,000 MPa at 20°C. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006306976(A) 申请公布日期 2006.11.09
申请号 JP20050130245 申请日期 2005.04.27
申请人 HITACHI CHEM CO LTD 发明人 TAKANO MARE;KAMIYA MASAMI
分类号 C08J5/24;B32B15/08;C08L33/04;H05K1/03 主分类号 C08J5/24
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