| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip chip mounting board wherein a solder projection can be formed at a predetermined position without making a wiring pattern larger in width. SOLUTION: A bump provided to a chip is mounted to a board by flip chip. Such a flip chip mounting board is comprised of a conductor pattern 2 formed on the board, and a solder mask 7 which is formed by covering the conductor pattern while a bonding pattern 6a to be joined with the bump is left as it is. The solder mask covers the conductor pattern while a sub-bonding pattern 2a is left, wherein the sub-bonding pattern is extended from the bonding pattern and is smaller in width than the bonding pattern. COPYRIGHT: (C)2007,JPO&INPIT
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