发明名称 APPARATUS AND METHOD FOR INSPECTING SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and a method for inspecting a substrate, capable of highly sensitively detecting a defect of the substrate, and to provide a method for manufacturing a semiconductor device, which is excellent in yield. SOLUTION: In the apparatus for inspecting the substrate, a movable aperture plate 81 having a plurality of apertures whose shapes and sizes correspond to portions of an object to be inspected, is disposed at a focal plane of a secondary electron beam, and apertures 81Bα-81Bγ, 81Dα-81Dγare selected such that the secondary electron beam which is emitted from an arbitrary portion of the object to be inspected at a high secondary-emission coefficient, passes through the movable aperture plate 81 and provides an image on a detection surface of an MCP detector 31. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006308460(A) 申请公布日期 2006.11.09
申请号 JP20050132318 申请日期 2005.04.28
申请人 TOSHIBA CORP 发明人 NAGAHAMA ICHIROTA;YAMAZAKI YUICHIRO;ONISHI ATSUSHI
分类号 G01N23/225;G01B15/00;H01J37/09;H01J37/29;H01L21/66 主分类号 G01N23/225
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