| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition excellent in fluidity, capable of reducing warping after curing and excellent in thermal shock resistance and to provide a semiconductor device by using the resin composition. SOLUTION: In the epoxy resin composition comprising (A) an epoxy resin which is liquid at normal temperature, (B) a curing agent and (C) an urethane resin as essential components, the urethane resin (C) has terminal-sealed groups obtained by blocking the terminal groups with a terminal sealing agent. The terminal-sealing agent is preferably an active hydrogen-containing compound. The semiconductor device is obtained by filling and bonding a gap between an electronic component and a substrate for mounting the electronic components by a cured product of the epoxy resin composition. COPYRIGHT: (C)2007,JPO&INPIT
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