发明名称 |
Semiconductor device and its manufacturing method |
摘要 |
To improve the reliability and yield of a thin-type semiconductor device as used for a stack-type flash memory, the semiconductor device is manufactured by upheaving each of semiconductor chips (semiconductor devices) obtained by dicing a semiconductor wafer on an adhesive sheet from a backside via the adhesive sheet using an upthrow jig to which ultrasonic vibration is applied so as not to break through the adhesive sheet, and by picking up each semiconductor chip.
|
申请公布号 |
US2006252233(A1) |
申请公布日期 |
2006.11.09 |
申请号 |
US20050503972 |
申请日期 |
2005.05.06 |
申请人 |
HONMA HIROSHI;OOROKU NORIYUKI;ODASHIMA HITOSHI |
发明人 |
HONMA HIROSHI;OOROKU NORIYUKI;ODASHIMA HITOSHI |
分类号 |
H01L21/00;H01L21/30;H01L21/46;H01L21/68;H01L29/94 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|