发明名称 MULTI-SIGNAL SINGLE BEAM PROBE
摘要 Methods and systems are provided for forming multiple electrical connections using a single probe suitable for semiconductor wafer probing and the parametric measurement of micro-devices. A conventional single-beam physical wafer probe structure can support two closely spaced and electrically independent probe contacts (21, 40) if an insulating sheath (25) overlaid by a conducting outside coaxial sheath (40) is used to provide a second independent probe contact (27, 28).
申请公布号 WO2005072438(A3) 申请公布日期 2006.11.09
申请号 WO2005US03095 申请日期 2005.01.27
申请人 RUCKER & KOLLS, INC.;CHOU, ARLEN 发明人 CHOU, ARLEN
分类号 G01R31/02;G01R1/067;G01R1/073 主分类号 G01R31/02
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