发明名称 |
MULTI-SIGNAL SINGLE BEAM PROBE |
摘要 |
Methods and systems are provided for forming multiple electrical connections using a single probe suitable for semiconductor wafer probing and the parametric measurement of micro-devices. A conventional single-beam physical wafer probe structure can support two closely spaced and electrically independent probe contacts (21, 40) if an insulating sheath (25) overlaid by a conducting outside coaxial sheath (40) is used to provide a second independent probe contact (27, 28). |
申请公布号 |
WO2005072438(A3) |
申请公布日期 |
2006.11.09 |
申请号 |
WO2005US03095 |
申请日期 |
2005.01.27 |
申请人 |
RUCKER & KOLLS, INC.;CHOU, ARLEN |
发明人 |
CHOU, ARLEN |
分类号 |
G01R31/02;G01R1/067;G01R1/073 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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