发明名称 HIGH THERMAL CONDUCTIVE COMPOUNDS
摘要 A multimodal particles having aspect ratios from 1 to about 1.6, for example multimodal diamond powder, is mixed into a suitable base like epoxy, potting compound or adhesive to form a compound with enhanced thermal conductivity. The powder may be hydrogenated in a blanket of hydrogen in an furnace after the furnace is purged by nitrogen or an inert gas to improve the aspect ratio.
申请公布号 WO2006091815(A3) 申请公布日期 2006.11.09
申请号 WO2006US06595 申请日期 2006.02.24
申请人 SOMMER, JARED, L. 发明人 SOMMER, JARED, L.
分类号 C08J5/12;B29C41/02 主分类号 C08J5/12
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