| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board having high reliability in conductivity in which generation of a void in a metal conductor for continuity between wiring conductors on upper and lower surfaces of an insulating substrate, peeling off of a metal conductor and the insulating substrate, and generation of cracking in the insulating substrate, are suppressed. SOLUTION: The metal conductor 4 is buried in a through-hole 2 formed in the insulating substrate 1, and the wiring conductors 3 formed on the upper and lower surfaces of the insulating substrate 1 are electrically connected through the metal conductor 4 to form the circuit board. Recesses 6 are formed on the upper and lower surfaces of the metal conductor 4. COPYRIGHT: (C)2007,JPO&INPIT
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