| 摘要 |
PROBLEM TO BE SOLVED: To provide a tool which can avoid adhesion of the terminal electrodes of respective chips in the process for forming the terminal electrodes. SOLUTION: Second thin plate members 21 and 22 are arranged on first thin plate members 11 and 12. A third thin plate member 30 is arranged on the second thin plate members 21 and 22 such that a component insertion hole 301 communicates with a cavity 201. The component insertion hole 301 has a maximum diameter dimension smaller than that of the cavity 201. The first thin plate members 11 and 12 close interconnection passages 301 and 201 formed in the thickness direction by the component insertion hole 301 and the cavity 201 at least partially. COPYRIGHT: (C)2007,JPO&INPIT
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