发明名称 |
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>A semiconductor package includes a semiconductor element having a circuit element arranged on a first surface of a semiconductor substrate; an external wiring region arranged on a second surface of the semiconductor substrate; a support substrate arranged on the first surface of the semiconductor substrate; an electrode pad arranged on the first surface of the semiconductor substrate; and a through electrode reaching from the electrode pad to the second surface of the semiconductor substrate.</p> |
申请公布号 |
KR20060115720(A) |
申请公布日期 |
2006.11.09 |
申请号 |
KR20067003434 |
申请日期 |
2004.08.25 |
申请人 |
FUJIKURA LTD.;OLYMPUS CORPORATION |
发明人 |
YAMAMOTO SATOSHI;SUEMASU TATSUO;HIRAFUNE SAYAKA;ISOKAWA TOSHIHIKO;SHIOTANI KOICHI;MATSUMOTO KAZUYA |
分类号 |
H01L21/60;H01L23/12;H01L23/48;H01L23/538;H01L25/065;H01L29/76 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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