发明名称 WIRING BOARD, PIEZOELECTRIC CERAMIC ELEMENT AND THEIR MANUFACTURING METHODS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board which can improve the adhesiveness of a polyparaxylene protective film and is excellent in reliability. <P>SOLUTION: The wiring board has a wiring electrode 101 on a substrate 100, and has a protective film 103 made of a polyparaxylene or its derivative to insulate an electrode front surface from an exterior on the wiring electrode 101. Further, the wiring board has a methacrylic acid dielectric structure or a vinyl group structure at one end to the electrode front surface of the opposite side at the side in contact with the substrate 100 of the wiring electrode 101 provided on the substrate 100, and has layer 102 comprising a phosphoric acid, phosphoric acid monoester, a carboxylic acid or anhydrous dicarboxylic acid structure to the other ends. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2006310499(A) 申请公布日期 2006.11.09
申请号 JP20050130616 申请日期 2005.04.27
申请人 KONICA MINOLTA HOLDINGS INC 发明人 HIRANO TADASHI;MATSUSHITA KODAI
分类号 H05K3/28;B05C5/00;B41J2/045;B41J2/055;B41J2/135;B41J2/14;B41J2/145;B41J2/16;H01L41/09;H01L41/187;H01L41/22;H01L41/23;H01L41/29 主分类号 H05K3/28
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