发明名称 SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technique capable of quick treatment by detecting abnormality when carrying a wafer automatically in a process for manufacturing a semiconductor device. SOLUTION: There are provided a wafer 17 for measurement having a vibration sensor, a memory for holding data detected by the vibration sensor, and a communication circuit for transmitting the data held by the memory; a controller 18 having a communication circuit for receiving the transmitted data, and a comparison circuit for comparing the received data with reference ones; and a FOUP 16 for storing the wafer 17 for measurement. Vibration waveform data that are measured by the wafer 17 for measurement and are being conveyed are fetched by the controller 18 by radio, and the controller 18 detects the abnormality in conveyance for generating an alarm. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006310349(A) 申请公布日期 2006.11.09
申请号 JP20050127579 申请日期 2005.04.26
申请人 RENESAS TECHNOLOGY CORP 发明人 TOKUNAGA KENJI
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
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