PACKAGE FOR AN IMPLANTABLE NEURAL STIMULATION DEVICE
摘要
The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.
申请公布号
WO2006118679(A2)
申请公布日期
2006.11.09
申请号
WO2006US10041
申请日期
2006.03.20
申请人
SECOND SIGHT MEDICAL PRODUCTS, INC.;GREENBERG, ROBERT, J.;NEYSMITH, JORDAN;WILKIN, KEVIN;OK, JERRY
发明人
GREENBERG, ROBERT, J.;NEYSMITH, JORDAN;WILKIN, KEVIN;OK, JERRY